It is gaining rapid strides in the data center business with integrated solutions that are highly competitive in prices. Intel, the world’s largest semiconductor company and primary supplier of microprocessors and chipsets, is gradually reducing its dependence on the PC-centric business by moving into data-centric businesses - such as AI and autonomous driving. The microelectronics packaging technology will ensure that defensive systems are enhanced with a 10x advantage in size, weight, and power over any other product currently available in the industry, as per Intel estimates. Intel’s solution allows DoD to streamline its supply chain, support ongoing semiconductor research and development and protect its vital capabilities domestically.
Intel’s EMIB technology’s simple design allows better flexibility and scalability and 3D Foveros technology provides greater performance with lower space utilization. Intel’s heterogeneous packaging technologies integrate embedded multi-die interconnect bridge (EMIB) with Intel Foveros technology, allowing DOD to rapidly identify, manufacture, test and induct state-of-the-art devices into operations. Manufactured under the company’s State-of-the-Art Heterogeneous Integrated Packaging (SHIP) program, Intel delivered the prototypes six quarters before the deadline, demonstrating the company’s innovation strength and highlighting its dedication toward customers.
Intel Corporation ( INTC Quick Quote INTC - Free Report) recently delivered cutting-edge multi-chip package (MCP) prototypes to support the DoD’s (Department of Defense) mission to modernize and enhance the defense industrial base’s capability to develop and deploy equipment crucial for national security.
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